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We will etch the Ti film effectively. We have options for standard thin film etching and Ti seed layer etching.
The features of this product are as follows: - It has minimal side etching, allowing for the formation of fine patterns. - The etching speed and in-plane uniformity of the etching shape are excellent. - It is suitable for laminated films such as Cu/Ti and W/Ti. Keywords: wet etching, titanium
For the Cu plating/Cu seed structure, it etches the Cu seed layer with minimal damage to the Cu plating wiring and bumps.
The features of this product are as follows: - There is less thinning of the Cu plating. - There is less surface roughness of the Cu. - It can be applied to various seed layers (from electroless copper plating to sputtered copper). - It supports various methods such as dip, spray, and spin. Keywords: wet etching, copper, plating, seed layer, selective semi-additive method.
We will etch the Au film well. There are also etching solutions for seed layers that cause little damage to the Au plating and allow for etching of the Au seed layer.
The features of this product are as follows: - It allows for processing at low temperatures and in a short time. - The etching speed and in-plane uniformity of the etching shape are excellent. - It is suitable for fine bump formation and pattern formation processes. Keywords: wet etching, gold, plating, seed layer, selective etching solution.
